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Seminar & Session Descriptions
| Wednesday, May 28th |
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8:30-11:15am
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Tutorial T1A: Introduction to MicroTCA (sponsored by Interphase) Chairperson: Ernie Bergstrom, Crystal Cube Consulting
“With development budgets cut to the bone, standardized platforms such as MicroTCA will be crucial to the success of many OEMs.”
— Simon Stanley, Light Reading
Instructors:
Introduction to MicroTCA
Nigel Forrester, MicroTCA Marketing Manager, Emerson Network Power
MicroTCA System Design Challenges
David Pursley, Pre-Sales Field Applications Engineer, Kontron
Chassis and Mechanical Issues
R.J. McLaren, Communications Market Manager, Pentair electronic Packaging/Schroff
Hardware Platform Management
Mark Overgaard, President/CEO, Pigeon Point Systems
MicroTCA Scale Economics
Bart Stuck, Managing Partner, Signal Lake Ventures and Executive Chairman of CorEdge Networks
Session Description:
MicroTCA is a new, low-cost, high-performance standard platform that is expected to find wide use in military, defense, telecom, medical, industrial and process control, aerospace, instrumentation, and other applications. This tutorial provides a basic introduction to an emerging technology that will be a multibillion dollar market within just a few years. It begins with an overview of platform-based system development and the design challenges associated with MicroTCA. The session will continue with brief overviews of MicroTCA hardware, software, power and interconnect, mechanical and thermal design, typical applications, and economics. Attendees will learn how MicroTCA platforms can help them develop a wide variety of equipment requiring low cost, small size, high performance, high maintainability, and scalability. The emphasis is on enabling attendees to make informed decisions about specifying, adopting, implementing, managing, or marketing MicroTCA components and MicroTCA-based products.
Intended Audience:
Technology managers, communications equipment designers, applications software developers, systems analysts and integrators, marketing and engineering managers, consultants, design specialists, design service providers, product managers, marketing engineers, sales engineers, and engineers at customer installations such as telcos and defense contractors.
About the Organizer:
Ernie Bergstrom is President of Crystal Cube Consulting, an analyst firm focused on AdvancedTCA, AdvancedMC, MicroTCA, and high-speed switch fabrics. He has over 25 years of industry experience including previous positions as a Senior Research Analyst for In-Stat/MDR and marketing manager and system engineer for Verizon (formerly GTE).
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8:30-11:15am
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Tutorial T1B: Achieving MicroTCA Interoperability Chairperson: Todd Keaffaber, CP-TA: Nirlay Kundu, CP-TA
Instructors:
Basics of MicroTCA Interoperability — Why and How?
Todd Keaffaber and Nirlay Kundu, CP-TA
The MicroTCA Interoperability Challenge
Chandresh Ruparel, Radisys
Benefits of Standards-Based Interoperable Building Blocks
Sven Freudenfeld, Kontron
Interoperability Lessons Learned During Platform Integration
Nirlay Kundu, Emerson Network Power
Thermal Considerations for AMCs in AdvancedTCA and MicroTCA
Rajesh Nair, Degree Controls
Interoperability Testing and Test Tools
Vinay Gupta, Polaris Networks
AMC Interoperability Overview in MicroTCA
Will Chu, CorEdge Networks
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8:30-9:45am
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OPEN - Session 101: Hardware Chairperson: Jim Harrison, Electronic Products
Paper Presenters:
One Core Fits All - MicroTCA Flexible Platforms Same Core
Clayton Tucker, Emerson Network Power
Extending the Flexibility of MicroTCA Using a Flexible AMC FPGA Platform
Ron Huizen, BittWare
AdvancedMC Development Boards - Fit the Slot Nicely
Nigel Dick, Freescale Semiconductor
Using iSCSI Boot for Server Flexibility
Jeff Hudgins, Network Engines
Wireless Communications Platform for 3G/4G Systems (Qualcomm Slimcat)
Will Chu, CorEdge Networks
Video Gateway Solutions for Delivery of MultiMedia Services in Wireless Networks
Ian MacMillan, Interphase
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10:00-11:15am
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OPEN - Session 102: Software Chairperson: Asif Naseem, GoAhead Software
Paper Presenters:
Pulling It All Together
Rod Anliker, Emerson Network Power
The Role of HA Middleware in Low Latency Service Composition
Al Hewitt, 4DK
Challenges in Scaling the Media Plane: Software Abstractions Needed to Outlive Multiple Hardware Generations
George Kontopidis, NMS Communications
OpenSAF - Accelerating the Transition to Base Platform Middleware
John Fryer, Emerson Network Power
Virtualization: The Bridge to Carrier Grade Linux and COTS Adoption
Glenn Seiler, Wind River
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11:15am-Noon
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OPEN - Keynote 1: How You Can Be Part of the Net-Centric Future
Speaker: Terry Morgan, Cisco Systems/NCOIC
Introducer: Ernie Bergstrom, Crystal Cube Consulting
Abstract: TBD
Rapid, efficient, cost-effective functionality is a common aspiration, leading many to the adoption of Network Centric Operations (NCO) in principle. Actually achieving NCO, however, remains a challenge of rapidly transforming business, as well as government and civil agencies. For legacy applications to work together, new systems to work with existing ones, and developing systems to operate seamlessly with and among other systems, while maintaining the integrity of proprietary information, the adoption of a common set of “building codes” is essential.
What does this mean to equipment makers and those who supply them? It means that they must consider the demands of network-centricity in developing their products. They must help overall system developers achieve their goals of network-centricity and interoperability. This requires adherence to the latest and most widely recognized standards whenever possible.
In determining how to help meet network-centric requirements, equipment makers can follows the lead of the Network Centric Operations Industry Consortium (NCOIC™), which focuses on enabling NCO by identifying common open standards and patterns. NCOIC™ is a not-for-profit international corporation committed to integrating open standards into an evolving global framework, employing a common set of principles and processes, to assist with the rapid global deployment of network-centric applications.
Established in August 2004, NCOIC has a global membership of leading defense firms, educational institutions, government agencies, information technology providers, service providers, standards groups, and systems integrators. NCOIC analyzes operational domains to understand the requirements of, and obstacles to, achieving net-centricity. The Consortium has developed a suite of analysis tools, and is adapting others that perform related functions.
The building codes and blocks identified by NCOIC help provide the common playing field for successful operations to occur, and allow for consistency of Systems Engineering methods and processes. As NCOIC is committed to providing open products for widespread use, the Consortium’s deliverables are made generally available to all interested parties at no cost.
About the Speaker:
Terry Morgan is Vice Chairman of the Network Centric Operations Industry Consortium (NCOIC), an international not-for-profit corporation formed in 2004 and dedicated to forming a common industry-wide technical infrastructure for enabling network centric operations – for faster delivery of NCO solutions to customers worldwide. He joined the NCOIC as a founding member in August 2004, serving on the Executive Council before being elected to the Vice Chairman role in September 2007.
Terry Morgan is the Director, Network Centric Strategy for Cisco Systems’ Global Government Solutions Group. He focuses on net centric strategies, solution requirements and acquisition business processes for global governments. As Cisco’s senior strategist, he meets with many nations, senior defense and business executives to extend the dialogue on developing global business and net-centric opportunities for the global defense and security community. He represents Cisco at executive levels of government, public and private partnerships, alliances, standards bodies and associations.
Prior to joining Cisco, Mr. Morgan held senior positions at US Robotics and 3Com where he drove business development in NATO and US Forces in Europe. He spent 24 years in the U.S. Marine Corp, where his assignments included Command at the artillery battalion and battery level, Assistant Chief of Staff Operations (G-3) Marine Forces Europe, U.N. Military Observer in Southern Lebanon, Division and Regimental Fire Support Coordinator, U.S. Army Field Artillery School instructor and Staff Officer at Headquarters.
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Noon-2:00pm
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Organizer: Keith Williamson, System Architect, Emerson Network Power
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2:00-5:00pm
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Tutorial T2A: MicroTCA Hardware Development Organizer: Mike Franco, CEO, MicroBlade
Instructors:
Introduction to MicroTCA Hardware Design
Mike Franco, CEO, MicroBlade
Low Cost MicroTCA Systems: Chip and Board Level Innovations
Will Chu, President, CorEdge Networks
Ruggedization of MicroTCA
Bob Sullivan, Hybricon and Stuart Jamieson, Emerson Network Power
Building a High-Reliability MicroTCA Storage System
Ted Vaida, Lead Systems Engineer, Astek
Common AdvancedMC/MicroTCA Platform Architecture for WiMAX and LTE Wireless Broadband Systems
Tim Summers, Operations Manager/DIgital Systems Engineering, Freescale Semiconductor
Deep Packet Processing with Multi-Threaded-SoC Enabled Blades
Aseem Parikh, VP and GM, Technology Solutions and Services, RMI and W. Joel D. Johnson, Software Defined Radio (SDR) Digital Transeiver Program Lead, Harris Government Communications Systems Division
Session Description:
MicroTCA creates significant hardware issues because of the small size of the boards, the use of high-performance processors and support chips, and the need for high-speed interconnect. This tutorial will review the basics of MicroTCA hardware development, introduce some board and chip-level innovations, and then deal with the ruggedization issue. Later sections will cover the design of storage systems and typical applications in wireless broadband and military communications.
Intended Audience:
Technology managers, hardware designers, communications equipment designers, systems analysts and integrators, engineering managers, consultants, design specialists, design service providers, and test engineers.
About the Organizer:
Mike Franco is CEO of MicroBlade, an AMC and MicroTCA products company providing leading edge technology components for use in telecommunications, enterprise, medical, industrial, and security markets. Mike is currently Chairman of the PICMG MicroTCA Subcommittee (which wrote the MicroTCA specification) and chairman of the Rugged MicroTCA.1 subcommittee. He was previously active within PICMG in developing the AdvancedMC specifications for mezzanine cards. He has been Director of Advanced Technologies at Artesyn Communications Products (now Emerson Network Power Embedded Computing) and CTO at Merge Technologies, a manufacturer of image networking products. He holds several patents in video image acquisition and image processing.
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2:00-5:00pm
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Tutorial T2B - MicroTCA Software Development Organizer: Jim Lawrence, Chief Software Standards Officer, Enea
Instructors:
Carrier Grade Linux for MicroTCA
Glenn Seiler, Director of Strategic Networking Initiatives, Wind River
Chassis and Platform Management
Mark Overgaard, Pigeon Point Systems
Designing HIghly Available Systems
Asif Naseem, President/COO, GoAhead Software and President of Service Availability Forum
Achieving Service Availability for MicroTCA Applications
Terry Pearson, VP of Product Management, Enea
Session Description:
The increasing focus on software as a way to provide value-add and product differentiation is creating new opportunities while producing challenges in identifying the required platforms, tools, and methodologies. This tutorial will explore approaches to maximizing the return on software development, particularly in the context of standards based technologies such as MicroTCA. Attendees will be introduced to general software requirements and architectures, embedded Linux as a base platform, high-availability middleware, management integration, and service availability. The focus will be on applying software platform technology to create highly available and reliable systems that are also powerful, flexible, and easy to manage.
Intended Audience:
Technology managers, business decision makers, defense, aerospace, telco and enterprise end users, independent software providers, systems architects, applications software developers, integrators, marketing and engineering managers, consultants, design specialists, and design service providers.
About the Organizer:
Jim Lawrence is Chief Software Standards Officer at Enea. He has been a leader in the communications industry for over 25 years, during which he pioneered many telecom technologies and solutions for Motorola, Intel, and OpenClovis. Currently, Jim is is applying 10 years of standards experience to driving next generation software platforms.
Jim is a member of the Service Availability Forum, where he serves as Member Relations Officer. In addition, he is currently co-chair of the Middleware Work Group within the SCOPE Alliance, and a member of the Manageability Task Force within the Communications Platforms Trade Association (CP-TA).
He has a Masters in Program Management from George Washington University and a BSEE from the University of Maryland.
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2:00-3:20pm
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OPEN - Session 103: Infrastructure (Mechanical/Chassis/Power Issues) Chairperson: R.J. McLaren, Schroff
Paper Presenters:
Power Module Operation in Redundant, High-Reliability Systems
Frank Cirolia, Emerson Network Power
Load Balancing Essential to Ethernet-Based MicroTCA Backplanes
Gary Lee, Fulcrum Microsystems
Disk Drive Storage Choices for MicroTCA Environments
Steve Looby, SanBlaze
Signal Integrity Simulation for DDR2 Memory on AdvancedMC Boards
Nigel Dick, Freescale Semiconductor
Rugged MicroTCA: A Detailed Look at Mechanical and Thermal Requirements
Eike Waltz, Elma Electronic
Integrated System Management Using Mixed-Signal Programmable Chips
Mike Brogley, Actel
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3:40-5:00pm
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OPEN - Session 104: Panel on Reducing Power Consumption (sponsored by Actel) Chairperson: Lee Goldberg, En-Genius
Panelists:
Mike Thompson, Actel
A.G. Karunakaran, GDA Technologies
Ian MacMillan, Interphase
Jim Bird, Texas Instruments
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5:00-7:00pm
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OPEN - Industry Reception (sponsored by ENEA) and Interoperability demo( coordinated by Emerson Network Power) |
7:00-8:30pm |
OPEN - Beer, Pizza and Chat with the Experts (featuring tables on specific subjects presided over by experts) - (sponsored by Wind River) Organizers: Stuart Jamieson, Emerson Network Power; Mike Christofferson, Enea
Expert Table Leaders:
Test and Development
Mike Franco, CEO, MicroBlade
WiMAX/LTE
Tim Summers, Operations Manager/Digital Systems Engineering, Freescale Semiconductor
Embedded Linux
Glenn Seiler, Director of Strategic Networking Initiatives, Wind River
Hardware
Sven Freudenfeld, Manager of Business Development, Kontron and Tony Romero, Senior Product Manager, Performance Technologies
Ruggedization
Eike Waltz, Technology Consultant, Elma Electronic
Economics
Clayton Tucker, Senior Marketing Manager, Emerson Network Power
Enterprise Applications
Nigel Forrester, MicroTCA Marketing Manager, Emerson Network Power
Software
Alastair Hewitt, Principal Software Architect, 4DK Technologies
COTS Ecosystem
Asif Naseem, President/COO, GoAhead Software and Charlie Ashton, Director of Software, AMCC Austin Design Center
Military/Defense/Aerospace Applications
Connie Beane, Director of Avionics, Enea and Bob Sullivan, Hybricon
Session Description:
This session will give attendees a chance to discuss a wide variety of subjects in an informal atmosphere and ask questions of experts in specific areas. Table subjects will include test and development, WiMAX/LTE, embedded Linux, hardware, infrastructure, economics, enterprise applications, software, thermal, COTS ecosystem, and military/defense/aerospace applications. Beer, wine, soft drinks, and pizza will be served to promote informality and encourage networking. Emphasis will be on frequently asked questions, best practices, hints and warnings, major issues, and key products and standards.
Intended Audience:
Hardware designers, project engineers, software designers, software engineers, technology managers, communications equipment designers, systems analysts and integrators, engineering managers, consultants, design specialists, design service providers, test engineers, and engineers at telecom providers and defense prime contractors.
About the Organizers:
Stuart Jamieson is Director of Industry Relations/Architect with Emerson Network Power Embedded Computing. He is responsible for strategic development with a particular focus on relations with Ericsson, Nokia, Alcatel, and Siemens. He is working heavily in the IMS, IP gateway, and media server market spaces. He also serves as Emerson Network Power’s primary representative to the SCOPE alliance and is a member of various PICMG committees. He has almost 20 years experience in the telecom industry. He received his MPhil and 1st Call Honours Degree in Electrical and Electronic Engineering from Heriot-Watt University.
Mike Christofferson is Director of Product Management at Enea. He has over 27 years experience in software development for embedded systems with such companies as Microtec/Ready Systems, Pulse Communications, GTE Telecom, Sprint, and Raytheon. His roles included a wide range of software development activities such as coding, testing, design, system specification, and time management. He received his B.S. in Physics from Bradley University (Peoria, IL) and his MS. In Physics from the University of Michigan.
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| Thursday, May 29th |
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8:30-10:00am
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OPEN - Session 201: The Customers Talk Back Chairperson: Eric Heikkila, Venture Development
Panelists:
Joe Leonard, Technology Evangelist and Director of Field Engineering, Global Velocity
W. Joel D. Johnson, SDR Digital Transceiver Program Lead, Harris Government Communications Systems Division
Report on New SCOPE Profiles
Leslie Guth, Marketing Chair,SCOPE Alliance and Co-Director of Planing, alcatel-Lucent
Tomasz Jezynski, DESY
Session Description:
Obviously, no standard platform can succeed without end user acceptance. What do users think of the current state of affairs in MicroTCA? What do they see as the major issues and how do they believe problems should be resolved? What is the time scale for accepting standards and moving into volume production? This session will present several leading users’ views of the current situation and near and long-term technical and marketing trends.
Meanwhile, leading telecom equipment manufacturers (TEMs) have already shown their support of MicroTCA by forming the SCOPE Alliance to promote it and other related standards. They are producing profiles that indicate their preferences and requirements to a wide range of vendors. A SCOPE spokesperson will describe the latest profiles covering MicroTCA and AMC.
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8:30-10:00am
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Session 202: Applications Chairperson: Nigel Dick, Freescale
Paper Presenters:
MicroTCA Applications: The View from the Sales Funnel
Stuart Jamieson, Emerson Network Power
Packet Processing in AdvancedMC and MicroTCA
Jeff Marden, GE Fanuc
Trends in Wireless Infrastructure and Effects on AMC Card Design
Dan Bouvier, AMCC
Creating Powerful, Low-Cost, Low-Power WiMAX BTS Solutions
Y.J. Kim, Cavium Networks
Accelerate Your Application
Tim Summers, Freescale Semiconductor
Developing Wireless Basestations in MicroTCA Systems with RapidIO AMCs
Dev Paul, Tundra Semiconductor
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10:00-11:00am |
OPEN - Special Market Research Session on Directions in MicroTCA
Presenter: Eric Heikkila, Venture Development
MicroTCA is expected to be a billion dollar market within just a few years with applications in telecom, military/defense/aerospace, industrial and process control, medical equipment, instrumentation, and even consumer electronics. Learn from a leading market researcher where MicroTCA fits, who is using it and why, and what will happen in the future.
Analyst Eric Heikkila of Venture Development Corporation (VDC) will examine trends for MicroTCA systems, boards, and infrastructure, covering:
- Current market
- Market forecasts
- User requirements driving MicroTCA adoption
- Market development opportunities
Eric will share findings from VDC’s in-depth supplier and user research into the MicroTCA market conducted over the past four years. The research emphasizes OEMs across the four key verticals: telecom/datacom, military/aerospace, industrial, and medical. The goal of the session is to leverage the data collected from potential MicroTCA users to help drive targeted market development activities.
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11:00am-Noon
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OPEN - Keynote 2: MicroTCA, Another Year Older and Deeper Embed
Speaker: Paul Virgo, Emerson Network Power
Introducer: Jim Harrison, Electronic Products
Abstract: MicroTCA, Another Year Older and Deeper Embed
It’s been almost two years since ratification of the MicroTCA specifications, and one year since the inaugural MicroTCA Summit and the first claimed design win. So where are we today, and what does the future hold? This presentation looks at several drivers of adoption, that is, issues that either impede or accelerate the use of MicroTCA in diverse applications. For example, commoditized cost is surely a big value proposition, but is the total cost of ownership really understood? Do products from different vendors interoperate or does the user face a lot of integration work? Are the thermal limitations of small physical packaging the Achilles heel or is it good enough for most applications? This presentation will discuss these issues and explore current industry trends.
About the Speaker:
Paul Virgo is the Director of Marketing responsible for MicroTCA and AdvancedMCs for the Embedded Computing business of Emerson Network Power. He has led the market development and launch of these technologies since their inception.
Virgo is a recognized author of many articles on embedded computers and backplane standards, and has spoken on these subjects at various conferences over the years. He holds a bachelor’s degree in electrical and electronic engineering from Portsmouth University, United Kingdom.
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11:00am-Noon
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OPEN - Keynote 3: MicroTCA Offers Innovation and Versatility
Speaker: Babu Narasimhan, Intel
Introducer: Lee Goldberg, En-Genius
Abstract: MicroTCA Offers Innovation and Versatility
The embedded computing industry is moving toward COTS platforms to deliver standards-based hardware that offers low cost, high flexibility, easy expansion and upgrade paths, shorter learning curves, simpler maintenance and repair, a large support ecosystem, and the ability to incorporate the latest technological advances. MicroTCA, in particular, has generated tremendous interest within the community. It offers a versatile platform that system integrators can use to develop solutions for a range of applications across multiple markets.
Early adopters have used MicroTCA in wireless communications for telecom and military networks. Developers are now exploring uses in military, storage, and other non-telecom applications, which will further solidify the commercial economic value proposition for the standard. The successful deployment of MicroTCA in such varied segments will require that robust tools, software, and silicon be readily available to a broad developer community. This is the only way that differentiation and value can be added easily and quickly across multiple applications and market segments.
This presentation will also describe briefly Intel products and tools that support MicroTCA platforms. It will touch upon the broad ecosystem of hardware and software vendors who can help system developers bring their products to market faster.
About the Speaker:
Babu Narasimhan is a Marketing Manager in Intel’s Embedded Computing Division. He is responsible for developing both market and product strategies for embedded applications. He joined Intel in 1999 as a Product Manager for Network Switches. Subsequently, he picked up responsibilities for modular and rackmount server platforms. He has also been involved in driving the use of Ethernet in cPCI backplanes.
Before joining Intel, Mr. Narasimhan held systems engineering positions at Evans and Sutherland, a developer of advanced graphics hardware. He has a Masters in Electrical Engineering from the University of Windsor (Ontario, Canada) and an undergraduate degree from J.N. Technological University in India.
Mr. Narasimhan has a strong interest in technology-related issues and initiatives. He has been engaged closely with customers and the ecosystem in enabling new usages. He holds three patents in the area of programmable logic technology.
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Noon-2:00pm
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Organizer: Keith Williamson, System Architect, Emerson Network Power
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2:00-3:00pm
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OPEN - Session 203: Developing Your MicroTCA Application (breakout sessions based on a typical application scenario) Organizer: Mike Franco, MicroBlade
“All this will not be finished in the first one hundred days…But let us begin.”
— John F. Kennedy, Inaugural Address, 1961
How do we get a MicroTCA project off the ground? What hardware, software, and infrastructure do we need? How do we define our objectives and determine what we need to meet them? What are the best practices we should follow? Where do we get the latest information? What are the key roadblocks we are likely to encounter?
This session will work on answering all these questions through discussion groups focused on a simple project scenario. Groups focused on hardware, software, and infrastructure will develop brief final reports including three best design principles, three good sources of current information, the single most important point attendees should take away with them, and the single most important warning attendees should heed. The groups will then join to report their findings, invite comments, and answer questions.
The example scenario project has the following parameters:
- Cost must be under $5,000 per unit complete, including infrastructure (chassis, connectors, cables, and accessories), AdvancedMC cards, and software (quantity 1,000)
- Development time must be less than 12 months
- System must fit in a standard 19” rack not more than 8U high
- Total power dissipation must not exceed 100 W
- All interfaces and standards must be open-standards compliant
- System must be capable of handling ten 10 Mbit Ethernet inputs (that is, throughput must be at least 100 Mbps)
- Hot swapping must be implemented
- System management software must provide complete supervision of boot sequence
- System management software must provide resource configuration and management
- System management software must provide robust fault detection and recovery
- System management software must be able to provide a warning within 1 minute of the time when the temperature exceeds a specific setpoint
- System must be able to operate over a standard temperature range of -20 degrees C to +50 degrees C.
The system must allow for the following later enhancements:
- Capability of handling twenty 10 Mbit Ethernet inputs (that is, throughput of 200 Mbps)
- Capability of handling 100 Mbit Ethernet inputs (that is, throughput of 1 Gbps)
- Operation over an extended temperature range of -40 degrees C to +85 degrees C
- Operation in a rugged environment involving high levels of shock and vibration
The hardware session will focus on:
- AdvancedMC cards (such as processor, I/O, or DSP)
- Interconnect
- Interfaces (such as Ethernet, Fibre Channel, or USB)
The software session will focus on:
- Operating system
- Software stacks
- Hardware platform management
- Middleware
- Application packages
The infrastructure session will focus on:
- Chassis
- Power
- Thermals
- Mechanical requirements
- Connectors
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2:00-2:40pm
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Hardware Design/Development
Session Leader: Tony Romero, Senior Product Manager, Performance Technologies; Ian MacMillan, Senior Product Marketing Manager, Interphase
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Software Design/Development
Session Leader: George Kontopidis, Senior VP/Chief Technologist, NMS Communications
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Infrastructure
Session Leader: R.J. McLaren, Communications Market Manager, Schroff
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2:40-3:00pm
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Joint Session and Reports
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| About the Organizer:
Mike Franco is CEO of MicroBlade, an AMC and MicroTCA products company providing leading edge technology components for use in telecommunications, enterprise, medical, industrial, and security markets. Mike was Chairman of the PICMG MicroTCA Subcommittee (which wrote the MicroTCA specification) and is currently chairman of the Rugged MicroTCA.1 subcommittee. He was previously active within PICMG in developing the AdvancedMC specifications for mezzanine cards. He has been Director of Advanced Technologies at Artesyn Communications Products (now Emerson Network Power Embedded Computing) and CTO at Merge Technologies, a manufacturer of image networking products. He holds several patents in video image acquisition and image processing.
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3:00-4:30pm
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OPEN - Session 204: MicroTCA Report Card - How are We Doing and What Needs to Happen? (sponsored by CorEdge Networks) Chairperson: Ernie Bergstrom, Crystal Cube Consulting
How is MicroTCA doing? What must happen for it to achieve higher volumes and greater acceptance? What are the major concerns today and how can they be resolved? Is the technology meeting expectations? Is it on its way to achieving the tremendous promise forecasters have predicted for it? This panel will grade MicroTCA efforts during the past year and give their opinions on what must happen now. They’ll cover such topics as product availability, hardware, software, infrastructure, rugged environments, pricing, interoperability, user acceptance, specification issues, and much more.
Panelists:
Heba Yacoub, Senior Manager of Sales and Marketing, MicroBlade
Clayton Tucker, Senior Marketing Manager, Emerson Network Power
Jim Lawrence, Chief Software Standards Officer, Enea
Michael Munroe, PICMG/Elma Bustronic
Ed Bizari, Performance Technologies
About the Chairperson:
Ernie Bergstrom is President of Crystal Cube Consulting, an analyst firm focused on AdvancedTCA, AdvancedMC, MicroTCA, and high-speed switch fabrics. He has over 25 years of industry experience including previous positions as a Senior Research Analyst for In-Stat/MDR and marketing manager and system engineer for Verizon (formerly GTE).
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| Friday, May 30th |
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8:30am-12:30pm
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Organizers: Tom Cox, RapidIO and Devashish Paul, Tundra Semiconductor
“RapidIO is a very flexible and scalable fabric used in both communications and military applications. It's a very sleek protocol that can even communicate chip-to-chip, unlike heavyweight protocols such as Ethernet and Infiband.”
— Richard Grigonis, TMCnet
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Session 1
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8:30-8:45am
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Introduction to RapidIO
Chairperson: Tom Cox, RapidIO
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8:45-9:15am
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Deploying RapidIO in MicroTCA Systems
Greg Tiedemann, Director of Business Development and Systems Engineering, Mercury Computer
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9:15-9:45am
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Is There a Value Proposition for RapidIO in Today's Multicore SoCs?
Greg Shippen, System Architect, Freescale Semiconductor
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9:45-10:15am
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Using RapidIO Backplanes in Wireless and Military MicroTCA Systems
Devashish Paul, Tundra Semiconductor
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10:15-10:30am
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Break
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Session 2
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10:30-11:00am
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Design Implementation of RapidIO in Wireless Infrastructure Systems
Manish Patel, Wireless Infrastructure Marketing Manager, Texas Instruments
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11:00-11:30am
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Bridging the Gap from Baseband to Antenna: Serial RapidIO to Common Public Radio Interface
Trevor Hiatt, Applications Manager, Integrated Device Technology/Flow Management Division
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11:30-Noon
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Serial RapidIO for Wireless Communication Fabrics in MicroTCA
Edward Young, Managing Director, CommAgility
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Noon-12:30pm
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Why Serial RapidIO is the fabric of choice for distributed multi-processing
Dave Barker, VP of Business Development, VMETRO
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Tutorial Description:
RapidIO® is an interconnect standard that uses high-performance, packet-switched technology. Its advantages are high speed, low latency, high throughput, multi-master and hot-swap capabilities, and inherent hardware implementation of quality-of-service. It is especially well-suited to high-availability telecom and military communications systems operating in the multi-gigabit range. It can support a variety of processors, DSPs, switches, and other hardware and software components. This tutorial will introduce the basics of RapidIO, illustrate its uses and advantages, and describe typical applications in wireless telecom and military systems.
Intended Audience:
Technology managers, communications equipment designers, applications software developers, systems analysts and integrators, marketing and engineering managers, consultants, design specialists, design service providers, product managers, marketing engineers, sales engineers, and engineers at customer installations such as telcos and defense contractors.
About the Organizers:
Tom Cox is the Executive Director for the RapidIO® Trade Association, where he is responsible for the future direction of the association, working with Committees and Working Groups, within the association to lead RapidIO technology development and market penetration. With nearly 30 years of experience in engineering, marketing and strategy, focusing on interconnects and standards, his expertise and industry relationships prove invaluable as RapidIO technology continues to penetrate the telecommunications, and embedded markets. He has previously experience with Tundra Semiconductor, IBM Microelectronics, ATI Technologies, LSI Logic, Litton Systems, and Philips Electronics. He has participated in many industry expert panel discussions, presented at conferences, worked with RapidIO Trade Association member training events, written technical papers, and assisted with the RapidIO book, RapidIO: The Embedded System Interconnect.
Devashish Paul is Product Marketing Manager for Serial RapidIO switching products at Tundra Semiconductor. Over the past 10 years, he has run product lines at Semiconductor Insights, Solidum Systems, Mosaid Semiconductor, and Nortel. For the first decade of his professional life, he tested F-18 Mission Computer Software and designed Imaging radar systems in the Canadian Air Force. He has an MSEE in Digital Signal Processing and an MBA from the University of Ottawa.
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